Optomec has showcased its newly released Aerosol Jet HD production system for electronics packaging at LOPEC conference in Munich, Germany.

The Aerosol Jet HD System is claimed to be a compact production platform which is configurable and can dispense a range of electronics materials with features as small as 20 microns.

It also has the capability to manufacture larger features ranging from 100’s of microns to millimetres and can print wide-area conformal coatings from 100 nanometers to 10’s of microns in thickness.

This system is based on Optomec’s Aerosol Jet technology which is used to directly print functional electronic circuitry and components onto a variety of substrates including planar and non-plana without the need for masks, screens or subtractive post-processing.

Claimed to be based on the company’s Aerosol Jet print engine, the HD system can offer high-resolution printed electronics for today’s most demanding advanced packaging applications including 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.

The in-line, modular design of the Aerosol Jet HD System lets it fit into almost all of the existing electronics manufacturing environment, where it can fill production gas and add to the functional printing capabilities. It is also claimed to offer a turn-key approach to advanced electronics packaging with the Aerosol Jet Print Engine and tool path generation software integrated into a standard dispense automation platform.

Aerosol Jet Product director Mike O’Reilly said: “The HD System builds upon our portfolio of 24X7 in-production Aerosol Jet 3D printed electronic solutions for Smartphone antenna and printed sensor applications.

“With our 20 micron (and up) scalable production processes, the HD system is well positioned to meet today’s and tomorrow’s most demanding advanced electronic packaging market needs.”

Optomec is a supplier of additive manufacturing systems. Its Aerosol Jet Systems for printed electronics and LENS 3D Printers for metal components are used by industry to reduce product cost and to improve performance.

LOPEC is a trade fair for printed electronics. It encompasses every aspect of emerging technology and covers and entire value chain starting from research and development to specific applications along with facilitates and essential business contacts.