Tessera Technologies has agreed to acquire US-based Ziptronix in an all-cash deal worth $39m.
The acquisition will add low-temperature wafer bonding technology platform to Tessera’s existing packaging capabilities, which will help it speed up the delivery of 2.5D and 3D-IC systems to semiconductor industry customers.
Tessera CEO Tom Lacey said: "With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable to our customers.
"Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property."
Based out of Raleigh in North Carolina, Ziptronix specializes in low-temperature direct bonding technology for 3D integration.
The company’s technologies also cater to next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices.
Tessera estimates that the market size utilizing such technology, including those for CMOS image sensors, will surpass $15bn by 2019.
Tessera’s subsidiary Invensas president Craig Mitchell said: "ZiBond and DBI bonding are enabling technologies that provide significant cost and performance benefits.
"There is a great opportunity to further develop these platforms with our technology partners, and we’re very excited about their market potential."