US-based semiconductor packaging provider Amkor Technology has signed an agreement to acquire Nanium, a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions, to strengthen its business.
Employing 550 people, Portugal-based Nanium is engaged in providing semiconductor assembly, packaging, test, engineering and manufacturing services.
The firm provides solutions ranging from package design to prototyping, wafer-level packaging (WLP), wafer probe, assembly and test, supply-chain management and drop shipping.
Amkor president and CEO Steve Kelley said: “This strategic acquisition will enhance Amkor’s position as one of the leading providers of WLP and WLFO packaging solutions.
“Building on NANIUM’s proven technologies, we can expand the manufacturing scale and broaden the customer base for this technology.”
Scheduled to be completed in the first quarter of 2017, the transaction is subject to customary closing conditions and regulatory approvals. Financial terms of the deal were undisclosed.
Nanium executive board president Armando Tavares said: “The Amkor transaction is a great fit for us and provides NANIUM and its employees with a strong platform for future growth.
“Amkor’s technology leadership, substantial resources and global presence coupled with NANIUM’s best-in-class WLFO packaging solutions will accelerate global acceptance and growth of this technology worldwide.”
The acquisition is part of Amkor’s efforts to strengthen its position in wafer-level packaging for smartphones, tablets and other applications.
Amkor has production facilities, product development centers, and sales and support offices in key electronics manufacturing regions in Asia, Europe and the US.