Smart Packaging 2004 is the latest in the growing Labelexpo series of global events. It will be launched alongside Labelexpo Americas 2004, on September 14-15, in Chicago.
Developed in co-operation with the Institute of Packaging Professionals, the two-day conference will cover all aspects of smart packaging and is expected to attract in excess of 200 delegates from the label, packaging and end user sectors. Delegates will also be able to visit Labelexpo Americas 2004 and see the latest smart label and smart packaging solutions exhibited by some key suppliers.
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