Capcon provides a full range of advanced packaging processes by offering die bonders for wafer-level packaging, panel-level packaging, Flip chip, SIP, and Stack Die
Capcon has raised around $50m in a series B2 funding round. (Credit: Capcon Limit)
Singapore-based advanced packaging solution provider Capcon has raised around $50m in a Series B2 funding round to boost its manufacturing, marketing, and research and development (R&D) operations.
Capcon Singapore offers to die bonders for wafer-level packaging, panel-level packaging, flip chip, SIP, and stack die, among other advanced packaging processes.
The firm has designed product series, designated as A series (Andromeda), L series (Leo), R series (Reticulum), M series (Monoceros), V series (Venus), and E series (Eridani) to enable advanced procedures in various circumstances.
Capcon is actively involved in a wide range of semiconductor, pan-semiconductor, and intelligent manufacturing industries.
The company introduced mass transfer equipment with high-precision pick-and-place technology. In addition, with testing and identifying capabilities, the company expanded to AOI tester and sorter.
Currently, Capcon Singapore has worked with close to 30 clients, including seven of the top 10 semiconductor manufacturers worldwide.
It has received numerous re-purchase orders from several premier equipment manufacturers, including ASE, SPIL, NEPES, and TFME.
Capcon inked a long-term supply arrangement with ASE at the beginning of 2022.
The advanced packaging solution provider anticipates that revenue will continue to climb threefold in 2023.
Additionally, they have extensive software & hardware development expertise in packaging machinery such as sorters, die bonders, wire bonders, and moulding machines.
According to the firm, a wider range of services can be anticipated as the fund in series B3 is currently being processed.