A flexible packaging area will be introduced at next year’s Ipex show. Located in Hall 1 of the 11-hall exhibition, which runs at the NEC in Birmingham, UK, from April 4-11, 2006, it will showcase new technologies and materials for the industry. In addition, a Flexible Packaging Centre of Excellence will host customer and supplier best practice case studies.
The show will also feature a Process Automation and JDF Pavilion that will highlight user solutions for improving production interoperability, productivity and profitability. The 250m2 pavilion will be prominently positioned in Hall 20 just a few steps away from a main entrance to the event. In addition, an MIS, JDF and Software trail will indicate those exhibitors showing JDF enabled process automation products and systems.
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